DocumentCode
156676
Title
The resilience wall: Cross-layer solution strategies
Author
Mitra, Subhasish ; Bose, Pradip ; Cheng, Eric ; Cher, Chen-Yong ; Cho, Hyungmin ; Joshi, Rajiv ; Kim, Young Moon ; Lefurgy, Charles R. ; Li, Yanjing ; Rodbell, Kenneth P. ; Skadron, Kevin ; Stathis, James ; Szafaryn, Lukasz
Author_Institution
Stanford University
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
11
Abstract
Resilience to hardware failures is a key challenge for a large class of future computing systems that are constrained by the so-called power wall: from embedded systems to supercomputers. Today´s mainstream computing systems typically assume that transistors and interconnects operate correctly during useful system lifetime. With enormous complexity and significantly increased vulnerability to failures compared to the past, future system designs cannot rely on such assumptions. At the same time, there is explosive growth in our dependency on such systems. To overcome this outstanding challenge, this paper advocates and examines a cross-layer resilience approach. Two major components of this approach are: 1. System and software-level effects of circuit-level faults are considered from early stages of system design; and, 2. resilience techniques are implemented across multiple layers of the system stack — from circuit and architecture levels to runtime and applications — such that they work together to achieve required degrees of resilience in a highly energy-efficient manner. Illustrative examples to demonstrate key aspects of cross-layer resilience are discussed.
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
Conference_Location
Hsinchu, Taiwan
Type
conf
DOI
10.1109/VLSI-DAT.2014.6834933
Filename
6834933
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