• DocumentCode
    1568117
  • Title

    High level event driven thermal estimation for thermal aware task allocation and scheduling

  • Author

    Cui, Jin ; Maskell, Douglas L.

  • Author_Institution
    Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2010
  • Firstpage
    793
  • Lastpage
    798
  • Abstract
    Thermal aware scheduling (TAS) is an important system level optimization for CMP and MPSoC. An event driven thermal estimation method which can assist dynamic TAS is proposed in this paper. The event driven thermal estimation is based upon a thermal map which is updated only when a high level event occurs. To minimize the overhead, while maintaining the estimation accuracy, the prebuilt look-up-tables and the superposition principle are used to speed up the solution of the thermal RC network. Experimental results show our method is accurate, producing thermal estimations of similar quality to existing thermal simulators, while having a considerably reduced computational complexity. Our event driven thermal estimation technique is significantly better, in terms of accuracy, than existing TAS schedulers, making it highly suitable for integration into the OS kernel.
  • Keywords
    computational complexity; multiprocessing systems; processor scheduling; system-on-chip; table lookup; task analysis; thermal analysis; MPSoC; chip multiprocessor systems; computational complexity; high level event driven thermal estimation method; look-up-tables; multiprocessor system-on-chip; superposition principle; thermal RC network; thermal aware scheduling; thermal aware task allocation; thermal simulators; Computational modeling; Design optimization; Dynamic scheduling; Job shop scheduling; Kernel; Processor scheduling; Runtime; Switches; Temperature; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419781
  • Filename
    5419781