• DocumentCode
    1568791
  • Title

    Simulation analysis of sensitivity for electrical capacitance tomography

  • Author

    Pei, Tian ; Wang, Wenliang

  • Author_Institution
    Dept. of Control Sci. & Eng., North China Electr. Power Univ., Baoding, China
  • fYear
    2009
  • Abstract
    Electrical capacitance tomography (ECT) is a process of image-based detection techniques, with good real-time, non-invasive, low-cost advantages, applicable to multiphase flow testing, has begun to be introduced into the measurement of two-phase flow. It can be the reconstruction of two-phase flows through the pipeline in its cross-sectional surface of the phase distribution of the image. The prerequisite is to be sensitive to the distribution market. In this paper, a capacitance sensor mathematical description, the establishment of a capacitance-sensitive field distribution in the mathematical model and its finite element model, introduce a sensitive method of calculation, and then use the finite element method to study electric field potential distribution-sensitive rule. The simulation results confirmed that: the sensitivity distribution function by the media distribution.
  • Keywords
    capacitive sensors; finite element analysis; tomography; capacitance sensor; capacitance-sensitive field distribution; cross-sectional surface; electric field potential distribution-sensitive rule; electrical capacitance tomography; finite element model; image-based detection techniques; multiphase flow testing; phase distribution; two-phase flow measurement; Analytical models; Capacitance measurement; Electric variables measurement; Electrical capacitance tomography; Finite element methods; Fluid flow measurement; Image reconstruction; Mathematical model; Pipelines; Testing; ANSYS; ECT; field-sensitive; finite element analysis; image reconstruction; two-phase flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-3863-1
  • Electronic_ISBN
    978-1-4244-3864-8
  • Type

    conf

  • DOI
    10.1109/ICEMI.2009.5274880
  • Filename
    5274880