• DocumentCode
    1568822
  • Title

    Configurable Multi-product Floorplanning

  • Author

    Ma, Qiang ; Wong, Martin D F ; Chao, Kai-Yuan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2010
  • Firstpage
    549
  • Lastpage
    554
  • Abstract
    Before VLSI design starts, it is strategically important to do product planning for targeted market segments that need specific applications, and to optimally reuse at different levels to save design and silicon costs with shorter time-to-market schedule. Conventional ASIC or SoC design floorplan usually targets for one single product; and, high efforts in re-floorplan and re-convergence for different products are still required if there is no pre-design stage multi-product planning. Therefore, the problem of designing floorplans at product or market planning stage that simultaneously optimizes multiple products, or multi-product floorplanning, is introduced. To the best of our knowledge, this is the first work in literature that addresses this newly emerged and financially important problem. We start with the necessary number of basic functional blocks to accommodate all the products, and pack them using a simulated annealing (SA) based floorplanner that can easily incorporate other costs (e.g., product finance weights). Given a candidate floorplan, we provide both an O(n3) exact algorithm and a O(n) greedy heuristic to identify the minimum feasible region for each product, where n is the number of basic blocks in this floorplan. These identification procedures are integrated into the SA framework to generate a floorplan that favors the configurable multi-product design. The effectiveness of our approach is validated by promising results on several data sets derived from industrial test cases.
  • Keywords
    VLSI; integrated circuit layout; simulated annealing; system-on-chip; VLSI design; application specific integrated circuits; minimum feasible region; predesign stage multiproduct floorplanning; simulated annealing; system-on-chip design floorplan; time-to-market schedule; Application specific integrated circuits; Cost function; Design optimization; Job shop scheduling; Product design; Silicon; Simulated annealing; Strategic planning; Time to market; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419824
  • Filename
    5419824