Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Author

Riedel, G.J. ; Schmidt, R. ; Liu, C. ; Beyer, H. ; Alaperä, I.

Author_Institution

Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland

fYear

2012

Firstpage

1

Lastpage

6

Abstract

Long term reliability is a key requirement for IGBT modules. Besides wire bond degradation solder degradation is a main mechanism leading to IGBT module failures. A numerical model was developed to describe the solder degradation process. The model includes elastic and (time independent) plastic deformation, as well as primary and secondary creep. To verify the model it was successfully applied to different temperature cycle experiments with SnPb solder as well as SnAgCu solder. It was found that primary creep cannot be neglected for SnAgCu solders.

Keywords

copper alloys; creep; elastic deformation; insulated gate bipolar transistors; lead alloys; lead bonding; plastic deformation; semiconductor device reliability; silver alloys; solders; temperature; tin alloys; IGBT module failure; SnAgCu; SnPb; elastic deformation; large area solder joints; long term reliability; numerical modeling; plastic deformation; primary creep; secondary creep; solder degradation process; temperature cycle; wire bond degradation; Creep; Degradation; Insulated gate bipolar transistors; Numerical models; Strain; Stress; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on

Conference_Location

Nuremberg

Print_ISBN

978-3-8007-3414-6

Type

conf

Filename

6170637