• DocumentCode
    1574097
  • Title

    Forming-free resistive switching with low current operation in graphene-insulator-graphene structures

  • Author

    Chakrabarti, B. ; Roy, Tonmoy ; Joiner, Corey A. ; Hesabi, Zohreh R. ; Vogel, Eric M.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2013
  • Firstpage
    55
  • Lastpage
    56
  • Abstract
    Graphene as a conducting electrode has attracted significant attention due to its low sheet resistance, high flexibility and high transparency [1]. Recently, high out-of-plane resistance of graphene has been utilized to reduce the operating current in metal oxide based resistive memories (RRAMs) [2]. However, this report also indicates that the high out-of-plane resistance of graphene contributes to the requirement of high-voltage forming (6 V) [2]. Since the forming step requires significantly higher voltage compared to regular set/reset operations, elimination of the forming step while maintaining the low-current operability is important for graphene RRAMs.In this work we demonstrate forming-free resistive switching in graphene-insulator-graphene (G-I-G) structures with graphene used as both top and bottom electrodes.
  • Keywords
    CVD coatings; aluminium compounds; atomic layer deposition; electrodes; electron beam deposition; graphene; random-access storage; titanium compounds; vacuum deposition; C; CVD; RRAM; TiO2-Al2O3-TiOx; annealing process; atomic layer deposition; conducting electrode; electron beam deposition; forming free resistive switching; graphene-insulator-graphene structures; low current operation; low sheet resistance; metal oxide based resistive memory; Aluminum oxide; Electrodes; Graphene; Resistance; Switches; Tin; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2013 71st Annual
  • Conference_Location
    Notre Dame, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4799-0811-0
  • Type

    conf

  • DOI
    10.1109/DRC.2013.6633790
  • Filename
    6633790