DocumentCode
15797
Title
0.25 μm emitter InP/InAlGaAs/GaAsSb double heterojunction bipolar transistor with passivation ledge exhibiting a current gain of over 100
Author
Kashio, Norihide ; Kurishima, Kenji ; Ida, Minoru ; Matsuzaki, Hideaki
Author_Institution
NTT Device Innovation Center, NTT Corp., Atsugi, Japan
Volume
50
Issue
22
fYear
2014
fDate
10 23 2014
Firstpage
1631
Lastpage
1633
Abstract
A suitable emitter structure for the fabrication of InP/InAlGaAs/GaAsSb double heterojunction bipolar transistors (DHBTs) with a passivation ledge is reported. With a composite emitter structure consisting of an InP and thin InAlGaAs, a passivation ledge can be easily fabricated by wet etching. A high current gain of 117 is obtained even for a 0.25 μm emitter DHBT with a base sheet resistance of about 1100 Ω/sq. The fabricated HBT also exhibits an fmax of more than 330 GHz while maintaining a breakdown voltage of more than 9 V.
Keywords
III-V semiconductors; aluminium compounds; etching; gallium arsenide; heterojunction bipolar transistors; indium compounds; passivation; semiconductor device breakdown; DHBT; InP-InAlGaAs-GaAsSb; composite emitter structure; double heterojunction bipolar transistor; passivation ledge; size 0.25 mum; wet etching;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2014.2774
Filename
6937293
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