• DocumentCode
    15797
  • Title

    0.25 μm emitter InP/InAlGaAs/GaAsSb double heterojunction bipolar transistor with passivation ledge exhibiting a current gain of over 100

  • Author

    Kashio, Norihide ; Kurishima, Kenji ; Ida, Minoru ; Matsuzaki, Hideaki

  • Author_Institution
    NTT Device Innovation Center, NTT Corp., Atsugi, Japan
  • Volume
    50
  • Issue
    22
  • fYear
    2014
  • fDate
    10 23 2014
  • Firstpage
    1631
  • Lastpage
    1633
  • Abstract
    A suitable emitter structure for the fabrication of InP/InAlGaAs/GaAsSb double heterojunction bipolar transistors (DHBTs) with a passivation ledge is reported. With a composite emitter structure consisting of an InP and thin InAlGaAs, a passivation ledge can be easily fabricated by wet etching. A high current gain of 117 is obtained even for a 0.25 μm emitter DHBT with a base sheet resistance of about 1100 Ω/sq. The fabricated HBT also exhibits an fmax of more than 330 GHz while maintaining a breakdown voltage of more than 9 V.
  • Keywords
    III-V semiconductors; aluminium compounds; etching; gallium arsenide; heterojunction bipolar transistors; indium compounds; passivation; semiconductor device breakdown; DHBT; InP-InAlGaAs-GaAsSb; composite emitter structure; double heterojunction bipolar transistor; passivation ledge; size 0.25 mum; wet etching;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2014.2774
  • Filename
    6937293