Finite Element Analysis Procedure for Board-level Swept Sine Vibration Tests

We derive in this paper equations of motion of board-level electronic packages subjected to swept sine vibration loads following the support excitation scheme. Harmonic analysis is performed based on the argument such that at each loading state over the swept sine process, hysteresis responses of solder joints following the isotropic hardening rule vanish fairly quickly so that plasticity is fully developed. Computed and measured acceleration response spectra of a board-level test vehicle are benchmarked