Development of wafer-scale sealing test using different size of micro-resonators

In this paper, we report a development of wafer-scale sealing test using different size micro-resonators. In order to characterize sealing quality, many research groups use vacuum sensors inside a cavity such as a comb-drive resonator or a diaphragm. Since the fabrication processes and structures are somewhat complicated, problems about the cost, yield and restriction of bonding materials can be arisen. In this study, we make the Si micro-cantilevers with different size for increase of measurable pressure range on pyrex glass wafers using 4-inch SOI wafers. In order to simplify the structures, external equipments for measuring the resonant characteristics and an external piezoelectric plate for excitation are used. As a result, the measurable pressure range is from about 0.1 to 1000 Pa. The surface of the test wafer can be Si or deposited metal films and even the non-patterned cap wafers also can be used