DocumentCode
1584455
Title
High-performance bulk CMOS technology with millisecond annealing and strained Si
Author
Sugii, T. ; Ikeda, K. ; Miyashita, T.
Author_Institution
FUJITSU LABORATORIES LTD., 1500 Mizono, Tado-cho, Mie-ken, 511-0192, Japan
fYear
2008
Firstpage
37
Lastpage
42
Abstract
High-performance planar, bulk CMOS technology for 45nm nodes and beyond is reviewed from the point of mobility enhancement techniques and millisecond annealing techniques. Through continuous efforts to increase on-current with the strained techniques while scaling transistor dimensions with millisecond annealing, competitive high-end CMOS technology for 45nm node was realized.
Keywords
Annealing; CMOS process; CMOS technology; Capacitive sensors; Costs; DSL; MOSFETs; Stress; Surface-mount technology; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors, 2008. RTP 2008. 16th IEEE International Conference on
Conference_Location
Las Vegas, NV, USA
Print_ISBN
978-1-4244-1950-0
Electronic_ISBN
978-1-4244-1951-7
Type
conf
DOI
10.1109/RTP.2008.4690536
Filename
4690536
Link To Document