• DocumentCode
    1584455
  • Title

    High-performance bulk CMOS technology with millisecond annealing and strained Si

  • Author

    Sugii, T. ; Ikeda, K. ; Miyashita, T.

  • Author_Institution
    FUJITSU LABORATORIES LTD., 1500 Mizono, Tado-cho, Mie-ken, 511-0192, Japan
  • fYear
    2008
  • Firstpage
    37
  • Lastpage
    42
  • Abstract
    High-performance planar, bulk CMOS technology for 45nm nodes and beyond is reviewed from the point of mobility enhancement techniques and millisecond annealing techniques. Through continuous efforts to increase on-current with the strained techniques while scaling transistor dimensions with millisecond annealing, competitive high-end CMOS technology for 45nm node was realized.
  • Keywords
    Annealing; CMOS process; CMOS technology; Capacitive sensors; Costs; DSL; MOSFETs; Stress; Surface-mount technology; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors, 2008. RTP 2008. 16th IEEE International Conference on
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    978-1-4244-1950-0
  • Electronic_ISBN
    978-1-4244-1951-7
  • Type

    conf

  • DOI
    10.1109/RTP.2008.4690536
  • Filename
    4690536