Research progress on free-space-wave add/drop multiplexing for WDM optical-interconnect system in packaging

Author

Ura, Shogo ; Kintaka, Kenji

Author_Institution

Kyoto Inst. of Technol., Kyoto, Japan

fYear

2010

Firstpage

1

Lastpage

4

Abstract

Integrated-optic devices enabling intra-board chip-to-chip optical interconnection with tens-terabit-per-second transmission bandwidth from two-dimensional (2D) array of vertical-cavity surface-emitting lasers to 2D array of photodiodes are reviewed. Design strategy and preliminary experimental results on wavelength-division-multiplexing signal transmission are also presented and discussed.

Keywords

electronics packaging; photodiodes; wavelength division multiplexing; WDM optical-interconnect system; free-space-wave add/drop multiplexing; integrated-optic devices; intra-board chip-to-chip optical interconnection; packaging; photodiodes; tens-terabit-per-second transmission bandwidth; two-dimensional array; wavelength-division-multiplexing signal transmission; Bandwidth; Optical arrays; Optical interconnections; Optical surface waves; Packaging; Photodiodes; Signal design; Surface emitting lasers; Vertical cavity surface emitting lasers; Wavelength division multiplexing; grating couplers; guided modes; integrated optics; optical interconnects; optical waveguides; wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Transparent Optical Networks (ICTON), 2010 12th International Conference on

Conference_Location

Munich

Print_ISBN

978-1-4244-7799-9

Electronic_ISBN

978-1-4244-7797-5

Type

conf

DOI

10.1109/ICTON.2010.5549273

Filename

5549273