• DocumentCode
    158770
  • Title

    Post-arc sheath simulation in vacuum circuit breaker with one-dimensional particle in cell-Monte Carlo collisions method

  • Author

    Mo, Y.P. ; Shi, Z. ; Jia, S. ; Wang, L.

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    Sept. 28 2014-Oct. 3 2014
  • Firstpage
    185
  • Lastpage
    188
  • Abstract
    In this paper, a one-dimensional (1-D) particle in cell-Monte Carlo collisions (PIC-MCC) model is developed to study the process of post-arc sheath expansion. In this model, both electrons and ions are treated as particles with their thermal velocities obeying the Maxwell-Boltzmann velocity distribution. The model takes the collision effects of ion-neutral (charge exchange collision and momentum exchange collision), and electron-neutral (scatter collision, excitation collision and ionization collision) into consideration. The simulation results are also compared with that calculated by the classical continuous transition model (CTM). In present work, the influence of some important factors, e.g. the density of initial residual plasma, the density of background metal vapor, the rising rate of transient recovery voltage (TRV) on the sheath expanding process are investigated.
  • Keywords
    Boltzmann equation; Monte Carlo methods; arcs (electric); plasma collision processes; plasma density; plasma sheaths; plasma simulation; vacuum circuit breakers; Maxwell-Boltzmann velocity distribution; PIC-MCC model; cell-Monte Carlo collisions method; charge exchange collision; initial residual plasma; momentum exchange collision; one-dimensional particle; post-arc sheath simulation; rising rate; thermal velocity; transient recovery voltage; vacuum circuit breaker; Anodes; Integrated circuit modeling; Metals; Plasma density; Transient analysis; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4799-6750-6
  • Type

    conf

  • DOI
    10.1109/DEIV.2014.6961650
  • Filename
    6961650