DocumentCode
158797
Title
Non-synchronous impact phenomena of closing operation in medium voltage vacuum circuit breakers
Author
Li Yu ; Uppalapati, Balaji ; Leusenkamp, Martin ; Bao, J. ; Chen, Ru Shan
Author_Institution
Eaton Corp. Res. & Technol., Shanghai, China
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
293
Lastpage
296
Abstract
The impact phenomenon of vacuum interrupters is a basic event while closing a vacuum circuit breaker. It reveals lots of information including the maximum impact force applied on the vacuum circuit breaker. And this impact force might lead to a mechanical failure of vacuum interrupters, mechanical structures of VCB and etc. The objective of this paper is to investigate non-synchronous impact phenomena of medium voltage VCB during the closing operation. PVDF (polyvinyldene fluoride) piezoelectric sensors were used to measure impact forces of three phases vacuum interrupter in medium voltage vacuum circuit breakers. A multi-body dynamic analysis simulation model was set up to analysis the interaction of impact forces among three phases by using an ADAMS software. The experimental results showed that the peak impact force of a medium voltage was increased linearly with the closing energy of vacuum interrupters. And the simulation results also showed that the effect of contact gap variation on the impact forces of three phases in the medium voltage vacuum circuit breakers.
Keywords
force measurement; piezoelectric transducers; polymers; system monitoring; vacuum circuit breakers; vacuum interrupters; ADAMS software; PVDF piezoelectric sensors; contact gap variation; mechanical failure; medium voltage VCB; medium voltage vacuum circuit breakers; multibody dynamic analysis simulation model; nonsynchronous impact phenomena; polyvinyldene fluoride piezoelectric sensors; vacuum interrupters; Circuit breakers; Contacts; Force; Interrupters; Medium voltage; Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961677
Filename
6961677
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