DocumentCode
158832
Title
Testing a Cu-8Cr-4Nb contact material in vacuum interrupters
Author
Li, Wenyuan ; Leusenkamp, Martin ; Ellis, D.
Author_Institution
Vacuum Interrupter Plant, Eaton Co., Horseheads, NY, USA
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
409
Lastpage
412
Abstract
GRCop-84 is a Cu-8 at.% Cr-4 at.% Nb alloy developed at NASA Glenn Research Center for use in rocket engine liners. Its high thermal and electrical conductivities make it a possible candidate for the electrical contact of a vacuum interrupter (VI). In this work, contacts were made from a warm rolled Cu-8Cr-4Nb plate and tested in a VI of the Axial Magnetic Field (AMF) type as well as a VI of the Transverse Magnetic Field (TMF) type. The material showed comparable performance in dielectric strength as well as current interruption to those of typical powder-metallurgically made or vacuum cast Cu-Cr contact materials. Contact resistance values are also in the same range as those of typical commercial Cu-Cr. Postmortem examinations of the VIs saw appearance of a significant melt depth, and rather fluid molten metal flow on the contact surface, and splashing on to the surrounding shields. The results of the testing are discussed in terms of the microstructure and properties of the GRCop-84 material. Future work to examine the addition of a fourth element and increased Cr2Nb content is proposed.
Keywords
chromium; contact resistance; copper; electrical contacts; magnetic fields; vacuum interrupters; AMF; Cu-Cr-Nb; GRCop-84; NASA Glenn Research Center; TMF; axial magnetic field; contact resistance values; contact surface; current interruption; dielectric strength; electrical conductivities; electrical contact; fluid molten metal flow; rocket engine liners; thermal conductivities; transverse magnetic field; vacuum interrupter; warm rolled Cu-8Cr-4Nb plate; Contacts; Interrupters; Materials; Niobium; Testing; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961706
Filename
6961706
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