• DocumentCode
    1593331
  • Title

    Experimental investigation of the behavior of microscopic bubbles in insulating liquids: influence of pressure and temperature

  • Author

    Qotba, R. ; Aitken, F. ; Denat, A.

  • Author_Institution
    Lab. d´´Electrostatique et de Materiaux Dielectriques, CNRS, Grenoble, France
  • fYear
    2005
  • Firstpage
    115
  • Lastpage
    118
  • Abstract
    The dynamics of microscopic bubbles in insulating liquids is investigated by optical methods. Each bubble is created by a fast and localized injection of electrical energy (∼nJ) initiated by a very high divergent electric field. Current pulse, bubble dynamics and emitted pressure waves are simultaneously measured as a function of hydrostatic pressure P (in the range 0.1-10 MPa), temperature (in the range 20-100°C) and nature of hydrocarbon liquids. Then, the distribution of energy is calculated and compared to available theories. The main results are: i) a bubble is formed whatever the temperature and the applied pressure, including those above the critical pressure Pc of the fluid, and ii) for P∞ > Pc, the maximum bubble size can be calculated from an evaluation of an equivalent "latent heat" (a latent heat has no meaning above Pc). In this case, the thermodynamic model uses an extrapolation of the saturated vapor pressure curve to define the conditions of "phase change" (i.e. a phase of smaller density than the liquid one).
  • Keywords
    bubbles; dielectric liquids; high-pressure effects; thermodynamics; 0.1 to 10 MPa; 20 to 100 degC; bubble dynamics; current pulse; electrical energy injection; emitted pressure waves; hydrocarbon liquids; insulating liquids; latent heat; microscopic bubbles; thermodynamic model; Current measurement; Dielectric liquids; Insulation; Optical microscopy; Optical pulses; Optical saturation; Pressure measurement; Pulse measurements; Stimulated emission; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dielectric Liquids, 2005. ICDL 2005. 2005 IEEE International Conference on
  • Print_ISBN
    0-7803-8954-9
  • Type

    conf

  • DOI
    10.1109/ICDL.2005.1490040
  • Filename
    1490040