The Ballistic Transport and Reliability of the SOI and Strained-SOI nMOSFETs with 65nm Node and Beyond Technology

In this paper, the device performance in terms of its transport characteristics and reliability of the MOS devices on the SOI and strained-SOI have been examined. For the first time, both the transport and reliability characteristics have been established from experimental SOI and SSOI nMOSFETs. It was characterized by two parameters, the ballistic efficiency and the injection velocity. Experimental verifications on nMOSFETs with both technologies with tensile-stress enhancement have been made. For SSOI devices, it shows the expected drain current enhancements. For the reliability evaluations, SOI shows a smaller lattice such that it exhibits a much worse hot carrier (HC) reliability, while SSOI device shows a poorer interface quality verified from the FN-stress experiment. In general, although SSOI exhibits a worse interface quality while its reliability is much better than that of SOI´s. Moreover, SSOI device shows a very high injection velocity as a result of the high strain of the device which makes it successful for drain current enhancement.