DocumentCode
1594342
Title
Physical design tradeoffs for ASIC technologies
Author
Banker, Jeffery ; Shanbhag, Arun ; Sherwani, Naveed
Author_Institution
Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA
fYear
1993
Firstpage
70
Lastpage
78
Abstract
Application Specific Integrated Circuit (ASIC) is a very broad definition and excludes only general-purpose processing, memory chips and circuits built using the standard building block chips. ASIC technology is cost effective that meets the challenges of today´s complex designs. The physical design tradeoffs for ASIC technologies are discussed. The tradeoffs for ASICs include tradeoffs between ASIC technologies and the physical design tradeoffs. The focus is on the physical design tradeoffs for ASICs, but, as technology tradeoffs and physical design tradeoffs go hand-in-hand, the tradeoffs between ASIC technologies are briefly discussed
Keywords
application specific integrated circuits; circuit layout CAD; digital integrated circuits; integrated circuit layout; logic CAD; logic partitioning; network routing; ASIC technologies; algorithms; circuit technology choice; compaction; design methodology; design styles; floorplanning; layout; partitioning; physical design tradeoffs; placement; routing; Application specific integrated circuits; CMOS technology; Circuit testing; Costs; Design methodology; Electronics packaging; Integrated circuit technology; Logic design; Logic testing; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International
Conference_Location
Rochester, NY
Print_ISBN
0-7803-1375-5
Type
conf
DOI
10.1109/ASIC.1993.410811
Filename
410811
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