• DocumentCode
    1594342
  • Title

    Physical design tradeoffs for ASIC technologies

  • Author

    Banker, Jeffery ; Shanbhag, Arun ; Sherwani, Naveed

  • Author_Institution
    Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA
  • fYear
    1993
  • Firstpage
    70
  • Lastpage
    78
  • Abstract
    Application Specific Integrated Circuit (ASIC) is a very broad definition and excludes only general-purpose processing, memory chips and circuits built using the standard building block chips. ASIC technology is cost effective that meets the challenges of today´s complex designs. The physical design tradeoffs for ASIC technologies are discussed. The tradeoffs for ASICs include tradeoffs between ASIC technologies and the physical design tradeoffs. The focus is on the physical design tradeoffs for ASICs, but, as technology tradeoffs and physical design tradeoffs go hand-in-hand, the tradeoffs between ASIC technologies are briefly discussed
  • Keywords
    application specific integrated circuits; circuit layout CAD; digital integrated circuits; integrated circuit layout; logic CAD; logic partitioning; network routing; ASIC technologies; algorithms; circuit technology choice; compaction; design methodology; design styles; floorplanning; layout; partitioning; physical design tradeoffs; placement; routing; Application specific integrated circuits; CMOS technology; Circuit testing; Costs; Design methodology; Electronics packaging; Integrated circuit technology; Logic design; Logic testing; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International
  • Conference_Location
    Rochester, NY
  • Print_ISBN
    0-7803-1375-5
  • Type

    conf

  • DOI
    10.1109/ASIC.1993.410811
  • Filename
    410811