Platform manufacturing technique for next generation integrated photonic components

Innovation in integrated photonics and associated fields is imperative with looming bottlenecks in the existing internet infrastructure due to rapidly increasing demand, across society and industry, for greater bandwidth and data access. A priority in this field is the development of a monolithic photonic integrated circuit (PIC), simplifying the design, manufacture and material requirements of current devices, with reduced cost, power and footprints. Furthermore, an improved efficiency and performance is highly sought after as this market anticipates explosive growth. Typically the key components are often made through disparate methods, and then packaged together for a final device. This creates an exciting opportunity for a novel platform technology to overcome such limitations and enhance existing capabilities while opening up new frontiers in device design and complexity.