A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality

Author

Han, Arum ; Wang, Ohia ; Mohanty, Swomitra K. ; Graff, Mason ; Frazier, A. Bruno

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

66

Lastpage

70

Abstract

A multi-layer plastic packaging technology has been developed for microfluidic systems containing electrical and mechanical functionality. Hot embossing and heat staking of plastics, micro stenciling of electrodes, and stereolithography was combined with conventional MEMS fabrication techniques to realize the system. The approach allows for multiple materials of fabrication, provides a solution to integration of electrical functionality throughout the system, and provides an interconnect technology for interfacing fluids and electrical components between the macro and the micro worlds

Keywords

biosensors; electroforming; microelectrodes; microfluidics; microsensors; moulding; plastic packaging; rapid prototyping (industrial); MEMS fabrication; biochemical analysis systems; biocompatible sheets; bond strength; electrical functionality; electrodes; electroformed molds; fine line metallization; fluidic inlets; fluidic outlets; heat staking; hot embossing; inner layer vias; integrated functionality; integrated ports; interconnect technology; mechanical functionality; micro stenciling; microfluidic systems; miniaturized bio analysis systems; multilayer plastic packaging technology; plastic bonding; polyethylene; polymethyl methacrylate; stereolithography; total analysis system; Bonding; Electrodes; Embossing; Fabrication; Microfluidics; Pharmaceutical technology; Plastic packaging; Polyethylene; Stereolithography; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Microtechnologies in Medicine & Biology 2nd Annual International IEEE-EMB Special Topic Conference on

Conference_Location

Madison, WI

Print_ISBN

0-7803-7480-0

Type

conf

DOI

10.1109/MMB.2002.1002266

Filename

1002266