DocumentCode
1596766
Title
Impact Analysis for Computer Simulating Multi-factor on Cement Slab Deflection
Author
Fang, Wang ; Kai, Liu ; Xuan-cang, Wang
Author_Institution
Sch. of Highway, Chang´´an Univ., Xi´´an, China
Volume
3
fYear
2010
Firstpage
528
Lastpage
532
Abstract
The three-dimensional models of void beneath old cement slab corner with joint are set up using finite element ANSYS software. Through simulating Falling Weight Deflectometer testing, the influence on deflection is analyzed by factors, such as void depth, void area, load transfer capacity, cement slab thickness and temperature, and fitted the relationship between various factors and deflection. It finds that the deflection value gradually increases with the void depth increasing, void area enlarging, load transfer capacity weakening, cement slab thickness thinning, the temperature rising; The deflection has linear relation with void depth, cement slab thickness, temperature, shows a quadratic relationship with void area, and meets exponential relationship with load transfer capacity. On the basis of computer models, correlation degree of the impact factors on the deflection is analyzed quantitatively by applying the grey relevance theory: cement slab thickness>load transfer capacity>temperature>void area>void depth. Research provides theoretical basis for the cement pavement design, void cause analysis, and the void development.
Keywords
cements (building materials); finite element analysis; reliability; slabs; voids (solid); cement slab deflection; cement slab thickness; computer models; correlation degree; falling weight deflectometer testing; finite element ANSYS software; grey relevance theory; load transfer capacity; multifactor computer simulation; void area; void depth; void three-dimensional models; Analytical models; Computational modeling; Computer simulation; Concrete; Finite element methods; Road transportation; Slabs; Stress; Temperature; Testing; computer simulation; deflection; multi-factor; relevance analysis; rigid pavement; voids;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Modeling and Simulation, 2010. ICCMS '10. Second International Conference on
Conference_Location
Sanya, Hainan
Print_ISBN
978-1-4244-5642-0
Electronic_ISBN
978-1-4244-5643-7
Type
conf
DOI
10.1109/ICCMS.2010.480
Filename
5421281
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