Nano-SiC added Ag paste sintering die-attach for SiC power devices

Low temperature and low pressure sintering Ag paste composed by sub-micro Ag particle and organic solvent was presented. The apparent improvement of bonding strength was realized by adding small amount of nano thickness Ag flake. Optimum proportion of sub-micro particle and nano thickness flake was determined. Nano-SiC particles were added into the optimized paste for sake of the possibility of properties advancement. The electrical property of newly developed Ag paste was measured by an improved test method. SiC die attachment and DBC (Direct Bonding Cu) substrate was conducted to test the practical application prospect of newly developed Nano-SiC added Ag paste.