• DocumentCode
    1602122
  • Title

    Packaging concept for a miniaturized wirelessly interrogable temperature logger

  • Author

    Mündlein, M. ; Nicolics, J. ; Brandl, M.

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Austria
  • Volume
    1
  • fYear
    2004
  • Firstpage
    68
  • Abstract
    We present the packaging concept of a miniaturized, biocompatible temperature logger. In a first application, the device will be cast in the palate piece of a removable brace to observe the wearing habit of the patient. For this purpose the temperature is measured with a pn junction and recorded using a micro controller which acts as a temperature logger and is capable of storing the thermal history from several months. This device is hermetically sealed using polymeric encapsulants. The data exchange is carried out using a wireless interrogating transponder using radio frequency identification device (RFID) technology. The function principle of this data transfer technology is explained briefly. Due to the limited space in the brace, an extremely high level of miniaturization is necessary. To reach this goal, the device is built-up as a multichip module using a single sided FR4 printed circuit board with a line width of down to 35 μm. The entire prototype fabrication process, including details on miniaturization related difficulties, is described. Also, the paper describes the finding and evaluation of a biocompatible casting material as needed for a medical application. An easy way for the direct assessment of water absorption and its effect on the electrical function of the module is also presented.
  • Keywords
    biomedical materials; casting; data loggers; intelligent sensors; microcontrollers; multichip modules; patient monitoring; radio applications; temperature measurement; temperature sensors; FR4 printed circuit board; RFID technology; biocompatible casting material; biocompatible temperature; brace; data transfer technology; intelligent sensor; microcontroller; miniaturized temperature logger; miniaturized wirelessly interrogable temperature logger; multichip module; packaging concept; palate piece; pn junction; polymeric encapsulants; radio frequency identification device technology; thermal history; water absorption; wireless interrogating transponder; Hermetic seals; History; Multichip modules; Packaging; Polymers; Radiofrequency identification; Space technology; Temperature control; Temperature measurement; Transponders;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
  • Print_ISBN
    0-7803-8422-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2004.1490378
  • Filename
    1490378