• DocumentCode
    1602518
  • Title

    Surface-Micromachined Neural Sensors with Integrated Double Side Recordings on Dry-Etch Benzocyclobutene(BCB) Substrate

  • Author

    Zhu, Haixin ; He, Jiping ; Kim, Bruce

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ
  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    526
  • Lastpage
    529
  • Abstract
    A neural sensor with novel structure and capable of double side recordings has been designed and fabricated using surface micromachining technique. Dry-etch benzocyclobutene (BCB) was selected as the substrate and packaging material for its excellent electrical, mechanical and thermal properties. Positive photoresist (AZ4620) was used as the sacrificial layer during the formation of backside recording sites, and the lift-off process combined with BCB dry etch technique was developed to open the recording sites on the backside. The finished device has intracortical recording sites on both sides, and also epidural recording sites on the front side. The total channel number doubled compared to that of single side electrode structure. Three dry-etch BCB layers were applied to insulate the front side conduction traces from the backside trace layer, and package the entire devices. The developed process shows reliable and high fabrication yield, and results suggest that this newly developed neural sensor could improve the performance and efficiency of neural recording
  • Keywords
    bioMEMS; biomedical electrodes; brain; microelectrodes; micromachining; microsensors; neurophysiology; photoresists; prosthetics; resins; dry-etch benzocyclobutene substrate; epidural recording sites; integrated double side recordings; intracortical recording sites; positive photoresist AZ4620; surface-micromachined neural sensors; Biological materials; Biosensors; Dry etching; Electrodes; Fabrication; Mechanical sensors; Micromachining; Packaging; Planarization; Silicon; Biocompatible polymer; Double-side recording; Dry-etch BCB; Neural Sensors; RIE etch; Via angle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-8741-4
  • Type

    conf

  • DOI
    10.1109/IEMBS.2005.1616464
  • Filename
    1616464