DocumentCode
1602773
Title
25 Gbps backplane links frequency and time domain characterization - correlation study between test and full-wave 3D EM simulation
Author
Amleshi, P. ; Shah, V. ; Zhiping Yang ; Mohan, J. ; Mukherjee, T.
Author_Institution
Molex Inc., Lisle, IL, USA
fYear
2011
Firstpage
809
Lastpage
813
Abstract
Designing backplane links at such high data rates requires the consideration of the interaction between active and passive components. The degree of interaction at 25 Gbps data rates requires a co-design approach with respect to active and passive blocks. In this paper, we start with modelling a 25 Gbps backplane channel in frequency domain and establish the correlation between results obtained from passive channel model and measurement. We further extend this analysis to establish correlation between chip test and chip-based simulation. In this study, we focus on the transmission performance of a 0.6-meter backplane channel operating at 25 Gbps, and expect similar performance in the presence of crosstalk with sufficiently isolated TX/RX grouping within the multi-lane backplane system.
Keywords
data communication; digital signal processing chips; time-frequency analysis; active components; backplane communication channel; backplane link frequency domain characterization; backplane link time domain characterization; bit rate 25 Gbit/s; chip test simulation; chip-based simulation; full-wave 3D EM simulation; isolated TX-RX grouping; multilane backplane system; passive channel measurement; passive channel model; passive components; transceiver chips; Backplanes; Connectors; Correlation; Scattering parameters; Semiconductor device measurement; Solid modeling; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location
Long Beach, CA, USA
ISSN
2158-110X
Print_ISBN
978-1-4577-0812-1
Type
conf
DOI
10.1109/ISEMC.2011.6038419
Filename
6038419
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