• DocumentCode
    1602773
  • Title

    25 Gbps backplane links frequency and time domain characterization - correlation study between test and full-wave 3D EM simulation

  • Author

    Amleshi, P. ; Shah, V. ; Zhiping Yang ; Mohan, J. ; Mukherjee, T.

  • Author_Institution
    Molex Inc., Lisle, IL, USA
  • fYear
    2011
  • Firstpage
    809
  • Lastpage
    813
  • Abstract
    Designing backplane links at such high data rates requires the consideration of the interaction between active and passive components. The degree of interaction at 25 Gbps data rates requires a co-design approach with respect to active and passive blocks. In this paper, we start with modelling a 25 Gbps backplane channel in frequency domain and establish the correlation between results obtained from passive channel model and measurement. We further extend this analysis to establish correlation between chip test and chip-based simulation. In this study, we focus on the transmission performance of a 0.6-meter backplane channel operating at 25 Gbps, and expect similar performance in the presence of crosstalk with sufficiently isolated TX/RX grouping within the multi-lane backplane system.
  • Keywords
    data communication; digital signal processing chips; time-frequency analysis; active components; backplane communication channel; backplane link frequency domain characterization; backplane link time domain characterization; bit rate 25 Gbit/s; chip test simulation; chip-based simulation; full-wave 3D EM simulation; isolated TX-RX grouping; multilane backplane system; passive channel measurement; passive channel model; passive components; transceiver chips; Backplanes; Connectors; Correlation; Scattering parameters; Semiconductor device measurement; Solid modeling; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
  • Conference_Location
    Long Beach, CA, USA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4577-0812-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2011.6038419
  • Filename
    6038419