• DocumentCode
    1603071
  • Title

    Creation of nanoelectronic devices by focussed ion beam implantation

  • Author

    Koch, J. ; Grün, K. ; Ruff, M. ; Wernhardt, R. ; Wieck, A.D.

  • Author_Institution
    Fac. of Phys. & Astron., Ruhr-Univ., Bochum, Germany
  • Volume
    1
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    35
  • Abstract
    In contrast to the fabrication of integrated circuits by current photolithography, a direct exposure of ions is proposed. This can be done by the very flexible means of focussed ion beam technology or by the more throughput-oriented ion beam projection. The applicability of the proposed ion beam implantation is demonstrated by prototypes of field-effect transistors, ohmic and active loads and the potential ability of arbitrarily implanted ion beam patterns. This was demonstrated to be feasible both on GaAs and on Si
  • Keywords
    focused ion beam technology; gallium arsenide; integrated circuit manufacture; integrated circuit technology; ion implantation; nanotechnology; silicon; 10 nm; FIB technology; GaAs; IC fabrication; Si; focussed ion beam implantation; integrated circuits; ion beam projection; nanoelectronic devices; Contamination; Electron beams; Ion beams; Lithography; Nanoscale devices; Physics; Resists; Solids; Throughput; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5735-3
  • Type

    conf

  • DOI
    10.1109/IECON.1999.822165
  • Filename
    822165