DocumentCode
1603071
Title
Creation of nanoelectronic devices by focussed ion beam implantation
Author
Koch, J. ; Grün, K. ; Ruff, M. ; Wernhardt, R. ; Wieck, A.D.
Author_Institution
Fac. of Phys. & Astron., Ruhr-Univ., Bochum, Germany
Volume
1
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
35
Abstract
In contrast to the fabrication of integrated circuits by current photolithography, a direct exposure of ions is proposed. This can be done by the very flexible means of focussed ion beam technology or by the more throughput-oriented ion beam projection. The applicability of the proposed ion beam implantation is demonstrated by prototypes of field-effect transistors, ohmic and active loads and the potential ability of arbitrarily implanted ion beam patterns. This was demonstrated to be feasible both on GaAs and on Si
Keywords
focused ion beam technology; gallium arsenide; integrated circuit manufacture; integrated circuit technology; ion implantation; nanotechnology; silicon; 10 nm; FIB technology; GaAs; IC fabrication; Si; focussed ion beam implantation; integrated circuits; ion beam projection; nanoelectronic devices; Contamination; Electron beams; Ion beams; Lithography; Nanoscale devices; Physics; Resists; Solids; Throughput; Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-5735-3
Type
conf
DOI
10.1109/IECON.1999.822165
Filename
822165
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