DocumentCode
160459
Title
FinFET SRAM design challenges
Author
Burnett, David ; Parihar, Sanjay ; Ramamurthy, H. ; Balasubramanian, S.
Author_Institution
Global Memory Solutions, GLOBALFOUNDRIES, Austin, TX, USA
fYear
2014
fDate
28-30 May 2014
Firstpage
1
Lastpage
4
Abstract
The utilization of FinFET devices in the SRAM cell provides many benefits over planar bulk devices due to the fully-depleted behavior with improved subthreshold slope, short-channel effects, drive current, and mismatch. However, the quantized nature of the fins results in several new challenges as compared to planar devices. For the layout of the SRAM cell with FinFETs, the cell width needs to match up with the periphery fin pitch to provide a smooth transition from the cell array to the periphery. For the highest-density SRAM cell comprised of single fins for each device, the minimum Vdd (Vmin) of the write operation becomes substantially worse than the read operation, thus requiring the use of write assist techniques for low Vdd operation. This paper highlights tradeoffs in cell size and Vmin for different FinFET cell configurations and the simulated Vmin improvements with several different assist approaches.
Keywords
MOSFET circuits; SRAM chips; integrated circuit design; FinFET SRAM design; FinFET cell configurations; cell array; cell width; drive current; fully-depleted behavior; improved subthreshold slope; mismatch; periphery fin pitch; planar bulk devices; short-channel effects; write assist techniques; Computer architecture; FinFETs; High definition video; Microprocessors; Robustness; SRAM cells; FinFET; SRAM; Vmin; fin pitch; read assist; write assist;
fLanguage
English
Publisher
ieee
Conference_Titel
IC Design & Technology (ICICDT), 2014 IEEE International Conference on
Conference_Location
Austin, TX
Type
conf
DOI
10.1109/ICICDT.2014.6838606
Filename
6838606
Link To Document