• DocumentCode
    1610532
  • Title

    Modification of electrically conductive adhesives for better mechanical and electrical properties

  • Author

    Mach, Pavel ; Richter, Luka ; Pie, Alena

  • Author_Institution
    Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
  • fYear
    2008
  • Firstpage
    228
  • Lastpage
    233
  • Abstract
    The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of solders. The electrical resistance and nonlinearity of I-V characteristic have been investigated. Two ways have been used for electrically conductive adhesive modification: addition of small amount of silver nanoparticles (grains) of three different dimensions into adhesive, and substitution of a part of filler flakes with the same amount of nanoparticles. It has been found that addition of silver nanoparticles increases the resistance and nonlinearity of adhesive. It has also been found that adhesives modified with nanoparticles have lower sensitivity to combined climatic ageing in comparison with adhesives without nanoparticles. The reason is other quality of contacts between flakes and contacts between nanoparticles.
  • Keywords
    ageing; conducting polymers; conductive adhesives; electrical conductivity; electrical resistivity; filled polymers; nanoparticles; silver; Ag; ageing; electrical resistance; electrically conductive adhesives; filler flakes; isotropic electrical conductivity; silver nanoparticles; solders; Conducting materials; Conductive adhesives; Conductivity; Contacts; Electric resistance; Independent component analysis; Mechanical factors; Nanoparticles; Optical materials; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276560
  • Filename
    5276560