Monitoring of the temperature profile of vapour phase reflow soldering

With the introduction of lead free electronics assembly worldwide, greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead-free production, greater care must be introduced to ensure proper reflow process control along with data logging for product traceability. Reflow profiles must be more precise in a lead free process since the reflow temperatures of the lead free materials can approach the temperature tolerance of some of the components.