• DocumentCode
    1611686
  • Title

    Creep test material rupture prediction by neural networks

  • Author

    Darwiche, M. ; Feuilloy, M. ; Schang, D. ; Bousaleh, G. ; Elguerjouma, R.

  • Author_Institution
    Eseo Inst. of Sci. & Technol., Angers, France
  • fYear
    2012
  • Firstpage
    902
  • Lastpage
    905
  • Abstract
    This work focuses on acoustic emission analysis of mechanisms damage in fiber composite materials, subjected to heavy loads during a creep test. The goal of the present study was to develop and evaluate machine learning algorithms for the prediction of material rupture with creep test by traction method. This study aimed to predict if a tensile specimen will break in 30 seconds or not. Multilayer Perceptrons were trained retrospectively in a group of 80 samples moments and tested prospectively in a group of 16 tensile specimens. During the 5-cross validations we reached a sensitivity of 88% and a specificity of 88% in the prospective group. The mean area under the ROC (Receiver Operating Curves) was equal to 0.86. Those results are very interesting because they are a first important step in the lifetime prediction of material rupture before significant damages can occur.
  • Keywords
    acoustic emission testing; creep fracture; creep testing; fibre reinforced composites; fracture toughness; fracture toughness testing; learning (artificial intelligence); life testing; mechanical engineering computing; multilayer perceptrons; tensile testing; ROC; acoustic emission analysis; creep test material rupture prediction; damage mechanism; fiber composite material; heavy load; lifetime prediction; machine learning algorithm; multilayer perceptron; neural network; receiver operating curve; sensitivity; specificity; tensile specimen; traction method; Acoustic emission; Biological neural networks; Creep; Sensitivity; acoustic emission; creep material rupture; neural networks; non destructive control abstract goes here;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sciences of Electronics, Technologies of Information and Telecommunications (SETIT), 2012 6th International Conference on
  • Conference_Location
    Sousse
  • Print_ISBN
    978-1-4673-1657-6
  • Type

    conf

  • DOI
    10.1109/SETIT.2012.6482034
  • Filename
    6482034