• DocumentCode
    1611862
  • Title

    High-performance 3D on-chip air-gap spiral inductor and its application to filter design

  • Author

    Hettak, K. ; Ross, T. ; Elgaid, K. ; Thayne, I.G. ; Wight, J. ; Morin, G.A.

  • Author_Institution
    Commun. Res. Centre Canada, Ottawa, ON, Canada
  • fYear
    2011
  • Firstpage
    1070
  • Lastpage
    1073
  • Abstract
    The air-gap three-dimensional symmetric inductor is developed by using an MMIC air bridge approach to realize a suspended inductor. The proposed inductor has a very high quality factor achieving a Q factor of about 30 for a 2.4 nH air-gap symmetric inductor. This paper also presents a miniature semi-lumped low-pass filter composed of a cascade of the proposed elevated low-loss lumped inductors and ultra-low impedance air gap thin film microstrip line (TFMS) sections. This results in a wide stopband up to a high frequency and, when combined with high quality factor suspended inductors, also gives a sharp roll-off at the cutoff frequency. The combined characteristics of these elements make for excellent low-pass filter performance. Finally, compact and harmonic suppression semi-lumped stubs based on a CPW/thin film microstrip combination using 3D on-chip air-core elevated symmetric inductors are proposed.
  • Keywords
    air gaps; inductors; low-pass filters; microstrip lines; 3D on-chip air-core elevated symmetric inductors; 3D on-chip air-gap spiral inductor; MMIC air bridge; Q factor; air-gap 3D symmetric inductor; air-gap symmetric inductor; filter design; harmonic suppression semi-lumped stubs; high quality factor suspended inductor; low-loss lumped inductors; miniature semi-lumped low-pass filter; stopband; thin film microstrip combination; ultra-low impedance air gap thin film microstrip line section; Coplanar waveguides; Impedance; Inductors; MMICs; Q factor; Substrates; CPW; Symmetric inductor; TFMS; air gap; low-pass and band-pass filters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
  • Conference_Location
    Melbourne, VIC
  • Print_ISBN
    978-1-4577-2034-5
  • Type

    conf

  • Filename
    6173940