• DocumentCode
    1614329
  • Title

    Advanced 3D metrology Atomic Force Microscope

  • Author

    Hua, Yueming ; Coggins, Cynthia ; Park, Sung

  • Author_Institution
    Park Syst. Inc., Santa Clara, CA, USA
  • fYear
    2010
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    With the continuous shrinkage of feature size in semiconductor devices, the accurate and reliable metrology of these devices has become very challenging. One aspect of metrology which has posed many challenges for integrated circuits (IC) fabrication is sidewall roughness characterization. Although, sidewall roughness is one of the most critical factors that needs to be characterized and well controlled, currently there is no existing technology that can measure the sidewall roughness well. Here, we present a new 3D metrology Atomic Force Microscope (AFM) capable of high resolution sidewall roughness measurements with improved repeatability and accuracy.
  • Keywords
    integrated circuit measurement; shrinkage; 3D metrology atomic force microscope; continuous shrinkage; integrated circuits fabrication; semiconductor devices; sidewall roughness; Crosstalk; Electron tubes; Force; Image resolution; Imaging; Metrology; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551408
  • Filename
    5551408