DocumentCode
1614329
Title
Advanced 3D metrology Atomic Force Microscope
Author
Hua, Yueming ; Coggins, Cynthia ; Park, Sung
Author_Institution
Park Syst. Inc., Santa Clara, CA, USA
fYear
2010
Firstpage
7
Lastpage
10
Abstract
With the continuous shrinkage of feature size in semiconductor devices, the accurate and reliable metrology of these devices has become very challenging. One aspect of metrology which has posed many challenges for integrated circuits (IC) fabrication is sidewall roughness characterization. Although, sidewall roughness is one of the most critical factors that needs to be characterized and well controlled, currently there is no existing technology that can measure the sidewall roughness well. Here, we present a new 3D metrology Atomic Force Microscope (AFM) capable of high resolution sidewall roughness measurements with improved repeatability and accuracy.
Keywords
integrated circuit measurement; shrinkage; 3D metrology atomic force microscope; continuous shrinkage; integrated circuits fabrication; semiconductor devices; sidewall roughness; Crosstalk; Electron tubes; Force; Image resolution; Imaging; Metrology; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location
San Francisco, CA
ISSN
1078-8743
Print_ISBN
978-1-4244-6517-0
Type
conf
DOI
10.1109/ASMC.2010.5551408
Filename
5551408
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