• DocumentCode
    1614597
  • Title

    Non-invasive Fiber Tracking on Diffusion Tensor MRI Using High-Temperature Superconducting Tape RF coil

  • Author

    Lin, In-Tsang ; Yang, Hong-Chang ; Kuo, Li-Wei ; Hsieh, Chang-Wei ; Yao, Ching ; Chang, Wei-Hao ; Chen, Chiou-ju ; Chen, Jyh-Horng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
  • fYear
    2006
  • Firstpage
    2329
  • Lastpage
    2332
  • Abstract
    High-temperature superconducting (HTS) coil is the reactance created by the inductive loop. A trimmer one of the best ways to increase the signal-to-noise ratio (SNR). Bi2Sr2Ca2Cu3Ox (Bi-2223) tapes were suitable to use because of the easier fabrications and lower cost. In this study, we built HTS Bi-2223 tape coils and demonstrated that the SNR of using the HTS tape coil was 3 or 4 folds higher than that of the traditional copper coil for a rat brain MR study. Acquisition time of MR diffusion tensor imaging (DTI) can be reduced by factor of 9 for the same signal-to-noise. Accuracy of fiber tracking using DTI is also significantly improved by a factor of 2.5 or so using HTS coil. In summary, with this HTSC system, a 3T MR system could reach the high signal-to-noise of 12 T MR system with the advantage of less T2 shortening effects at high field. Currents researches are focused on brain connectivity and fMRI studies
  • Keywords
    biomedical MRI; bismuth compounds; brain; calcium compounds; copper compounds; high-temperature superconductors; strontium compounds; superconducting coils; 12 T; 3 T; Bi2Sr2Ca2Cu3O; HTS Bi-2223 tape coils; brain connectivity; diffusion tensor MRI; high-temperature superconducting tape RF coil; inductive loop; noninvasive fiber tracking; rat brain; signal-to-noise ratio; Costs; Diffusion tensor imaging; Fabrication; High temperature superconductors; Magnetic resonance imaging; Radio frequency; Signal to noise ratio; Superconducting coils; Superconducting films; Tensile stress; Bi-2223; DTI; HTS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-8741-4
  • Type

    conf

  • DOI
    10.1109/IEMBS.2005.1616933
  • Filename
    1616933