• DocumentCode
    1615471
  • Title

    Developing a high volume manufacturing method to eliminate P Buried Layer implant defects

  • Author

    Sehgal, Akshey ; Budri, Thanas ; Klatt, Jeffrey ; Printy, Craig ; Ruby, Scott ; Ramdani, Jamal

  • Author_Institution
    Nat. Semicond. Corp., S Portland, ME, USA
  • fYear
    2010
  • Firstpage
    211
  • Lastpage
    212
  • Abstract
    Atomic Force Microscopy, Deep Level Transient Spectroscopy and Secondary Ion Mass Spectroscopy were used to study defects created in the P Buried Layer while using a BF2 implant. The P Buried Layer defects were traced to the unintentional co-implantation of Mo along with the BF2 implant. Using a Tungsten source, instead of a Molybdenum source for the BF2 implant, reduced but did not eliminate these defects. A novel, high volume processing method was developed to produce metal contamination-free buried layers and verified by deep level transient spectroscopy spectra.
  • Keywords
    BiCMOS integrated circuits; atomic force microscopy; bipolar transistors; boron compounds; buried layers; deep level transient spectroscopy; molybdenum; secondary ion mass spectra; semiconductor device manufacture; surface contamination; BiCMOS PNP transistors; Jk:BF2,Mo; P buried layer implant defect elimination; atomic force microscopy; deep level transient spectroscopy spectra; high volume manufacturing method; metal contamination-free buried layers; secondary ion mass spectroscopy; unintentional coimplantation; Contamination; Hafnium; Implants; Surface treatment; Transistors; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551450
  • Filename
    5551450