DocumentCode
1615967
Title
Lean implementation in a GaAs semiconductor factory
Author
Dopp, Douglas
Author_Institution
VP Wafer Fabrication, Anadigics, Inc., Adi Moran, VP Oper., AMCG USA, Ltd., Warren, NJ, USA
fYear
2010
Firstpage
297
Lastpage
300
Abstract
Lean Manufacturing principles were introduced in an existing Gallium Arsenide IC factory which manufactures state-of-the-art RF products. While the products produced in this factory were of cutting-edge performance and design, much of the equipment and factory procedures were vintage and in some cases outdated. This situation had worked well at modest production volumes; however, ramping to high-volume production has proven difficult. After introducing a new production framework based on Lean Manufacturing principles, dramatic improvements have been achieved in all aspects of factory performance. We will describe the implementation strategy, discuss some of the roadblocks that had to be eliminated, and give a summary of the improvements which were achieved.
Keywords
III-V semiconductors; gallium arsenide; integrated circuit manufacture; lean production; manufactured products; radiofrequency integrated circuits; semiconductor device manufacture; wide band gap semiconductors; cutting edge performance; gallium arsenide IC factory; lean manufacturing principle; semiconductor factory; state-of-the-art RF products; Industries; Manufacturing; Materials; Organizations; Production facilities;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location
San Francisco, CA
ISSN
1078-8743
Print_ISBN
978-1-4244-6517-0
Type
conf
DOI
10.1109/ASMC.2010.5551468
Filename
5551468
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