• DocumentCode
    1615967
  • Title

    Lean implementation in a GaAs semiconductor factory

  • Author

    Dopp, Douglas

  • Author_Institution
    VP Wafer Fabrication, Anadigics, Inc., Adi Moran, VP Oper., AMCG USA, Ltd., Warren, NJ, USA
  • fYear
    2010
  • Firstpage
    297
  • Lastpage
    300
  • Abstract
    Lean Manufacturing principles were introduced in an existing Gallium Arsenide IC factory which manufactures state-of-the-art RF products. While the products produced in this factory were of cutting-edge performance and design, much of the equipment and factory procedures were vintage and in some cases outdated. This situation had worked well at modest production volumes; however, ramping to high-volume production has proven difficult. After introducing a new production framework based on Lean Manufacturing principles, dramatic improvements have been achieved in all aspects of factory performance. We will describe the implementation strategy, discuss some of the roadblocks that had to be eliminated, and give a summary of the improvements which were achieved.
  • Keywords
    III-V semiconductors; gallium arsenide; integrated circuit manufacture; lean production; manufactured products; radiofrequency integrated circuits; semiconductor device manufacture; wide band gap semiconductors; cutting edge performance; gallium arsenide IC factory; lean manufacturing principle; semiconductor factory; state-of-the-art RF products; Industries; Manufacturing; Materials; Organizations; Production facilities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
  • Conference_Location
    San Francisco, CA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-6517-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2010.5551468
  • Filename
    5551468