• DocumentCode
    1619291
  • Title

    Mutual ballasting: A novel technique for improved inductive system level IEC ESD stress performance for automotive applications

  • Author

    Salman, Adnan Ahmed ; Farbiz, Farzan ; Concannon, Ann ; Edwards, Hal ; Boselli, G.

  • Author_Institution
    Texas Instrum., Dallas, TX, USA
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    A new ESD failure mode under inductive IEC stress of automotive CAN pins is identified. Inductor saturation causes increase of the rise-time from ins to ~20ns, leading to non-uniform conduction in the bidirectional ESD circuit. A new mutual ballasting layout technique is introduced to recover the system level ESD performance.
  • Keywords
    automotive electronics; electrostatic discharge; failure analysis; ESD failure mode; IEC ESD stress performance; automotive CAN pins; bidirectional ESD circuit; inductive IEC stress; inductive system level; inductor saturation; mutual ballasting layout technique; system level ESD performance; Electrostatic discharges; Fingers; Hidden Markov models; IEC; Inductors; Stress; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0739-5159
  • Type

    conf

  • Filename
    6635916
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1619291