Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)

Author

Yoshikawa, Hiroshi ; Kawasaki, Atsuko ; Tomoaki ; Iiduka ; Nishimura, Yasushi ; Tanida, Kazumasa ; Akiyama, Kazutaka ; Sekiguchi, Masahiro ; Matsuo, Mie ; Fukuchi, Satoru ; Takahashi, Katsutomu

Author_Institution

Toshiba Semicond., Yokohama

fYear

2009

Firstpage

476

Abstract

Through silicon via (TSV) is one of the necessary technologies for three-dimensional integration of LSIs. Heterogeneous system integration is a good candidate for its application, which includes the "Vision Chip". TSV technology is applied to a CMOS imager sensor camera module for mobile handsets and successfully achieves a size reduction of 55% in volume and 36% in footprint, which we refer to as a chip scale camera module (CSCM). To the best of the authors\´ knowledge, CSCM is the first mass-produced product using TSV technology.

Keywords

CMOS image sensors; chip scale packaging; large scale integration; 3D LSI integration; CMOS imager sensor camera module; LSI; TSV technology; chip scale camera module; heterogeneous system integration; mass-produced product; mobile handsets; three-dimensional integration; through-silicon-via process; vision chip; CMOS image sensors; CMOS logic circuits; Cameras; Costs; Insulation; Surface-mount technology; Through-silicon vias; Wafer bonding; Wires; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International

Conference_Location

San Francisco, CA

Print_ISBN

978-1-4244-3458-9

Type

conf

DOI

10.1109/ISSCC.2009.4977515

Filename

4977515