DocumentCode
1620453
Title
Chip-level electro-thermal simulation of bipolar transistor circuits
Author
Moinian, Shahriar ; Feldmann, Peter ; Melville, Robert C.
Author_Institution
AT&T Bell Labs., Reading, PA, USA
fYear
1994
Firstpage
123
Lastpage
126
Abstract
This paper presents accurate electro-thermal circuit-level modeling of both self and mutual heating for bipolar transistor IC devices. In addition, thermal transmission line network models are used to characterize the important mutual heating among devices on a chip. The models have been implemented in a new electro-thermal analog circuit simulator, Sframe, with robust convergence due to parameter continuation methodology
Keywords
integrated circuit modelling; IC devices; Sframe; analog circuit simulator; bipolar transistor circuits; chip-level simulation; circuit-level modeling; electro-thermal simulation; mutual heating; parameter continuation methodology; robust convergence; self heating; thermal transmission line network models; Bipolar transistor circuits; Circuit simulation; Coupling circuits; Heat sinks; Heat transfer; Heating; Integrated circuit modeling; MOSFETs; Predictive models; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting,1994., Proceedings of the 1994
Conference_Location
Minneapolis, MN
Print_ISBN
0-7803-1316-X
Type
conf
DOI
10.1109/BIPOL.1994.587877
Filename
587877
Link To Document