• DocumentCode
    1620611
  • Title

    A non-contact temperature measurement of semitransparent silicon wafers with absorption edge wavelength

  • Author

    Iuchi, Tohru ; Shinagawa, Ryo

  • Author_Institution
    Sensor Photonics Res. Center, Toyo Univ., Toyo
  • fYear
    2008
  • Firstpage
    941
  • Lastpage
    945
  • Abstract
    The temperature dependence on transmittance of a silicon wafer is well known, which is caused by various absorption mechanisms over wide range of spectrum. As the wavelength increases, the photon energy decreases until it becomes smaller than the minimum energy gap in the silicon band structure. At this point there is a rapid drop in absorption, which is often referred to as absorption edge wavelength. The absorption edge shifts to a longer wavelength with increasing temperature because the band gap reduces with increasing temperature. Experiments were carried out from the viewpoints of wavelength (900 ~1700 nm), polarization (p- and s-polarized) and direction (normal to 80deg) for specimens with different resistivity (0.01 ~ 2700 Omegacm). A characteristic curve between absorption edge wavelength and temperature is obtained for all of silicon wafers with different resistivity. The results show that this method is promising for in situ temperature measurements of silicon wafers from room to 1000 K at a wavelength where the wafers are semitransparent. In this paper, an experimental apparatus, measurement results and considerations on advantages and disadvantages of this method are described in detail.
  • Keywords
    absorption; elemental semiconductors; monolithic integrated circuits; silicon; temperature measurement; Si; absorption edge wavelength; noncontact temperature measurement; semitransparent silicon wafers; silicon band structure; Absorption; Conductivity; Furnaces; Optoelectronic and photonic sensors; Photonic band gap; Pollution measurement; Silicon; Temperature control; Temperature measurement; Wavelength measurement; Absorption edge wavelength; Band gap energy; Semiconductor; Silicon wafer; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control, Automation and Systems, 2008. ICCAS 2008. International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-89-950038-9-3
  • Electronic_ISBN
    978-89-93215-01-4
  • Type

    conf

  • DOI
    10.1109/ICCAS.2008.4694630
  • Filename
    4694630