DocumentCode
1623497
Title
Shielded high performance interconnect technology dramatically increases real signal density
Author
Cohen, Tom ; Patel, Gautam
Author_Institution
Teradyne Connection Syst. Inc., Nashua, NH, USA
fYear
1997
Firstpage
140
Lastpage
145
Abstract
Teradyne has developed a highspeed, high-density board-to-board interconnect, called VHDM, which will meet most industry needs with respect to mechanical and electrical characteristics. An extremely robust connector will be described with excellent mechanical attributes which also dramatically increases pin density and maintains a high level of signal integrity. This connector will provide up to 101 real signals per linear inch at sub-500ps risetimes for differential or single-ended applications. The paper will focus on the mechanical and electrical performance challenges that were overcome during the design of the product
Keywords
crosstalk; electric connectors; printed circuit accessories; shielding; Teradyne; VHDM; board-to-board interconnect; electrical characteristics; mechanical attributes; mechanical characteristics; pin density; product design; robust connector; shielded high performance interconnect technology; signal density; signal integrity; single-ended applications; Conductors; Connectors; Contacts; Crosstalk; Electric variables; Frequency; Geometry; Impedance; Integrated circuit interconnections; Telecommunication computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Wescon/97. Conference Proceedings
Conference_Location
Santa Clara, CA
ISSN
1095-791X
Print_ISBN
0-7803-4303-4
Type
conf
DOI
10.1109/WESCON.1997.632329
Filename
632329
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