• DocumentCode
    1623497
  • Title

    Shielded high performance interconnect technology dramatically increases real signal density

  • Author

    Cohen, Tom ; Patel, Gautam

  • Author_Institution
    Teradyne Connection Syst. Inc., Nashua, NH, USA
  • fYear
    1997
  • Firstpage
    140
  • Lastpage
    145
  • Abstract
    Teradyne has developed a highspeed, high-density board-to-board interconnect, called VHDM, which will meet most industry needs with respect to mechanical and electrical characteristics. An extremely robust connector will be described with excellent mechanical attributes which also dramatically increases pin density and maintains a high level of signal integrity. This connector will provide up to 101 real signals per linear inch at sub-500ps risetimes for differential or single-ended applications. The paper will focus on the mechanical and electrical performance challenges that were overcome during the design of the product
  • Keywords
    crosstalk; electric connectors; printed circuit accessories; shielding; Teradyne; VHDM; board-to-board interconnect; electrical characteristics; mechanical attributes; mechanical characteristics; pin density; product design; robust connector; shielded high performance interconnect technology; signal density; signal integrity; single-ended applications; Conductors; Connectors; Contacts; Crosstalk; Electric variables; Frequency; Geometry; Impedance; Integrated circuit interconnections; Telecommunication computing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wescon/97. Conference Proceedings
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-4303-4
  • Type

    conf

  • DOI
    10.1109/WESCON.1997.632329
  • Filename
    632329