• DocumentCode
    1625493
  • Title

    Progress on model building and statistical analysis methodology of IC characteristics with process

  • Author

    Yie, He ; Jiannan, Yao

  • Author_Institution
    Microelectron. Center, Southeast Univ., Nanjing, China
  • fYear
    1990
  • Firstpage
    189
  • Lastpage
    196
  • Abstract
    Combined with a microelectronic test structure, an experimental design model building methodology is developed, where a self-consistent subdomain decomposition method is used to assure high accuracy and reasonable computation costs simultaneously. With some examples, the application of the derived regression model in IC performance prediction and optimum process design is discussed. A real-time statistical process analysis methodology that is incorporated with the experimental design method is presented. The applicability of the real-time statistical analysis methodology is demonstrated
  • Keywords
    integrated circuit technology; semiconductor device models; statistical analysis; IC characteristics; IC performance prediction; design model building methodology; microelectronic test structure; optimum process design; process analysis methodology; real-time methodology; regression model; statistical analysis methodology; subdomain decomposition method; Application specific integrated circuits; Automatic testing; Buildings; Computational efficiency; Design for experiments; Integrated circuit modeling; Microelectronics; Predictive models; Process design; Statistical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1991. ICMTS 1991. Proceedings of the 1991 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-87942-588-1
  • Type

    conf

  • DOI
    10.1109/ICMTS.1990.161739
  • Filename
    161739