DocumentCode
1625493
Title
Progress on model building and statistical analysis methodology of IC characteristics with process
Author
Yie, He ; Jiannan, Yao
Author_Institution
Microelectron. Center, Southeast Univ., Nanjing, China
fYear
1990
Firstpage
189
Lastpage
196
Abstract
Combined with a microelectronic test structure, an experimental design model building methodology is developed, where a self-consistent subdomain decomposition method is used to assure high accuracy and reasonable computation costs simultaneously. With some examples, the application of the derived regression model in IC performance prediction and optimum process design is discussed. A real-time statistical process analysis methodology that is incorporated with the experimental design method is presented. The applicability of the real-time statistical analysis methodology is demonstrated
Keywords
integrated circuit technology; semiconductor device models; statistical analysis; IC characteristics; IC performance prediction; design model building methodology; microelectronic test structure; optimum process design; process analysis methodology; real-time methodology; regression model; statistical analysis methodology; subdomain decomposition method; Application specific integrated circuits; Automatic testing; Buildings; Computational efficiency; Design for experiments; Integrated circuit modeling; Microelectronics; Predictive models; Process design; Statistical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1991. ICMTS 1991. Proceedings of the 1991 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-87942-588-1
Type
conf
DOI
10.1109/ICMTS.1990.161739
Filename
161739
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