• DocumentCode
    1627908
  • Title

    Power semiconductor devices: design and manufacturing for improved field reliability (invited)

  • Author

    Shenai, Krishna

  • Author_Institution
    Electr. & Comput. Eng. Dept., Illinois Univ., Chicago, IL, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Abstract
    In the information age, power electronic systems need to demonstrate, "nine 9\´s" of field reliability. The current reliability performance of most power converters is at best is in the range of "six 9\´s." A dramatic improvement in device robustness is needed to successfully address the emerging market demand. In this paper, we discuss a new "top-down" system-level approach to identify and correct excessive field failures in compact high-frequency computer and telecom power supplies. We outline approaches to design and manufacture robust power semiconductor switches that guarantee "built-in" field reliability.
  • Keywords
    failure analysis; power semiconductor switches; power supplies to apparatus; semiconductor device reliability; computer power supplies; device robustness; field failures; field reliability; power semiconductor devices; reliability performance; semiconductor switches; telecom power supplies; top-down system-level approach; Circuit testing; Computer aided manufacturing; Power semiconductor switches; Power supplies; Power system reliability; Robustness; Semiconductor device manufacture; Semiconductor device reliability; Stress; Telecommunication computing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems, 2002. Proceedings of the Fourth IEEE International Caracas Conference on
  • Print_ISBN
    0-7803-7380-4
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2002.1004104
  • Filename
    1004104