DocumentCode
1628262
Title
Application of holographic pattern measuring system for deformation analysis of printed circuit board due to thermal stress
Author
Nethu, Takanori ; Kameyama, Kazuhiro ; Taniguchi, Masanari ; Takagi, Tasuku ; Chubach, Norifumi
Author_Institution
Tohoku Bunka Gakuen Univ., Sendai, Japan
Volume
3
fYear
2004
Firstpage
2020
Abstract
By using both FEMLAB and the thermography, the thermal pattern was analyzed of thermally stressed printed circuit board along with the deformation pattern by using the holographic pattern measuring system (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3D graphic image.
Keywords
deformation; holography; image processing; infrared imaging; measurement systems; printed circuits; thermal stresses; 3D graphic image; FEMLAB; deformation analysis; holographic pattern measuring system; printed circuit board; thermal stress; thermography;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE 2004 Annual Conference
Conference_Location
Sapporo
Print_ISBN
4-907764-22-7
Type
conf
Filename
1491775
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