DocumentCode
1628674
Title
Microelectronics in the “More than Moore” era
Author
Wise, Kensall D.
Author_Institution
Center for Wireless Integrated Microsyst., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2010
Firstpage
3
Lastpage
4
Abstract
As we move beyond scaling ("More Moore") to attack critical problems in health care, the environment, infrastructure, security, and energy, microsystems will be required that combine low-power micro-electronics with sensing, wireless interfaces, advanced packaging, and energy scavenging. They will create major new markets, ushering in what has been called the "More than Moore" era.
Keywords
integrated circuits; low-power electronics; advanced packaging; energy scavenging; low-power microelectronics; more than Moore era; sensing; wireless interface; Actuators; Biomarkers; Communication system security; Silicon; Software; Wireless communication; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2010
Conference_Location
South Bend, IN
ISSN
1548-3770
Print_ISBN
978-1-4244-6562-0
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2010.5551936
Filename
5551936
Link To Document