• DocumentCode
    1628674
  • Title

    Microelectronics in the “More than Moore” era

  • Author

    Wise, Kensall D.

  • Author_Institution
    Center for Wireless Integrated Microsyst., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2010
  • Firstpage
    3
  • Lastpage
    4
  • Abstract
    As we move beyond scaling ("More Moore") to attack critical problems in health care, the environment, infrastructure, security, and energy, microsystems will be required that combine low-power micro-electronics with sensing, wireless interfaces, advanced packaging, and energy scavenging. They will create major new markets, ushering in what has been called the "More than Moore" era.
  • Keywords
    integrated circuits; low-power electronics; advanced packaging; energy scavenging; low-power microelectronics; more than Moore era; sensing; wireless interface; Actuators; Biomarkers; Communication system security; Silicon; Software; Wireless communication; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2010
  • Conference_Location
    South Bend, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4244-6562-0
  • Electronic_ISBN
    1548-3770
  • Type

    conf

  • DOI
    10.1109/DRC.2010.5551936
  • Filename
    5551936