• DocumentCode
    1630264
  • Title

    Thermal-aware testing of network-on-chip using multiple-frequency clocking

  • Author

    Liu, Chunsheng ; Iyengar, Vikram ; Pradhan, D.K.

  • Author_Institution
    Dept. of Comput. & Electron. Eng., Nebraska-Lincoln Univ., Omaha, NE
  • fYear
    2006
  • Lastpage
    51
  • Abstract
    Chip overheating due to excessive and unbalanced power dissipation has become a critical problem during test of complex core-based systems. In this paper, we address the overheating problem in network-on-chip systems by using on-chip multiple-frequency clocking. We control the core temperatures during test scheduling by varying the test clock frequency assigned to each core, so that the power dissipation of each core during test can be adjusted individually and thermal balance is achieved. We present a heuristic where the optimization process can be integrated with test scheduling. Experimental results for NoC benchmarks show that the proposed method can guarantee thermal safety and yield better thermal balance
  • Keywords
    circuit testing; clocks; network-on-chip; thermal analysis; chip overheating; multiple frequency clocking; network-on-chip; test clock frequency; thermal aware testing; Clocks; Frequency; Logic testing; Network-on-a-chip; Power dissipation; Power system management; Safety; System testing; Temperature control; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium, 2006. Proceedings. 24th IEEE
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7695-2514-8
  • Type

    conf

  • DOI
    10.1109/VTS.2006.88
  • Filename
    1617561