DocumentCode
1630264
Title
Thermal-aware testing of network-on-chip using multiple-frequency clocking
Author
Liu, Chunsheng ; Iyengar, Vikram ; Pradhan, D.K.
Author_Institution
Dept. of Comput. & Electron. Eng., Nebraska-Lincoln Univ., Omaha, NE
fYear
2006
Lastpage
51
Abstract
Chip overheating due to excessive and unbalanced power dissipation has become a critical problem during test of complex core-based systems. In this paper, we address the overheating problem in network-on-chip systems by using on-chip multiple-frequency clocking. We control the core temperatures during test scheduling by varying the test clock frequency assigned to each core, so that the power dissipation of each core during test can be adjusted individually and thermal balance is achieved. We present a heuristic where the optimization process can be integrated with test scheduling. Experimental results for NoC benchmarks show that the proposed method can guarantee thermal safety and yield better thermal balance
Keywords
circuit testing; clocks; network-on-chip; thermal analysis; chip overheating; multiple frequency clocking; network-on-chip; test clock frequency; thermal aware testing; Clocks; Frequency; Logic testing; Network-on-a-chip; Power dissipation; Power system management; Safety; System testing; Temperature control; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2006. Proceedings. 24th IEEE
Conference_Location
Berkeley, CA
Print_ISBN
0-7695-2514-8
Type
conf
DOI
10.1109/VTS.2006.88
Filename
1617561
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