3D IC testing using a chip prober and a transparent membrane probe card

Author

Watanabe, N. ; Aoyagi, Masahiro ; Eto, Masamichi ; Kawano, Katsumi

Author_Institution

Nano-Electron. Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan

fYear

2014

fDate

24-27 March 2014

Firstpage

92

Lastpage

97

Abstract

We performed pre- and post-bond testing of static random access memory (SRAM)/flash memory chips using a chip prober with a transparent membrane probe card. By deformation of the polyethylene naphthalate film (base material of the probe card) during probing, low-load and damage-less probing was possible, and we successfully conducted pre-bond testing of 30-50-μm-thick SRAM/flash memory chips and post-bond testing of stacked chips.

Keywords

SRAM chips; deformation; flash memories; integrated circuit testing; polymer films; probes; three-dimensional integrated circuits; 3D IC testing; SRAM; chip prober; damage-less probing; flash memory chips; low-load probing; polyethylene naphthalate film deformation; post-bond testing; pre-bond testing; size 30 mum to 50 mum; stacked chips; static random access memory; transparent membrane probe card; Films; Flash memories; Probes; Random access memory; Stacking; Testing; Voltage measurement; chip prober; polyethylene naphthalate (PEN) film; post-bond testing; pre-bond testing; three-dimensional integrated circuit; transparent membrane probe card;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures (ICMTS), 2014 International Conference on

Conference_Location

Udine

ISSN

1071-9032

Print_ISBN

978-1-4799-2193-5

Type

conf

DOI

10.1109/ICMTS.2014.6841474

Filename

6841474