A semi-distributed method for inductor de-embedding

Author

Dang, Jian ; Noculak, Achim ; Korndorfer, F. ; Jungemann, Christoph ; Meinerzhagen, B.

Author_Institution

BST, Tech. Univ. Braunschweig, Braunschweig, Germany

fYear

2014

fDate

24-27 March 2014

Firstpage

141

Lastpage

145

Abstract

This paper presents a de-embedding method based on pad and thru test structures for on-wafer inductor characterization. A transmission line model in combination with parallel admittances describing the pads is used to characterize the thru test structure. This method is compared to the standard “open-short”, “open-thru” and “pad-open-short” de-embedding methods and electromagnetic simulations. It is demonstrated that the proposed method is more accurate or saves chip area compared to the standard de-embedding methods.

Keywords

electric admittance; electromagnetic fields; inductors; transmission line theory; chip area; electromagnetic simulations; inductor de-embedding; on-wafer inductor characterization; pad test structures; parallel admittances; semidistributed method; thru test structures; transmission line; Inductance; Inductors; Metals; Power transmission lines; Scattering parameters; Transmission line matrix methods; Transmission line measurements; De-embedding; Electromagnetic simulation; Transmission matrix modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures (ICMTS), 2014 International Conference on

Conference_Location

Udine

ISSN

1071-9032

Print_ISBN

978-1-4799-2193-5

Type

conf

DOI

10.1109/ICMTS.2014.6841482

Filename

6841482