Development of a 3D measuring system for semiconductor patterned wafers

Author

Nakajima, Keiji ; Kosaka, Nobuyuki ; Tomoda, Toshimasa ; Sakaue, Yoshikazu ; Tsutsumi, Ritsuko

Author_Institution

Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1990

Firstpage

497

Abstract

A fast, automated measuring system has been developed which provides 3D information about semiconductor wafer patterns nondestructively from scanning electron microscope images. The 3D measurement is conducted in two different ways for different patterns: one is pattern height measurement using only one image for trapezoidal patterns, while the other is height profile measurement for smoothly curved surfaces. The system proved capable of measuring 3D shape sufficiently fast (within 5 s) and with sufficiently good accuracy to control the semiconductor wafer process line

Keywords

computerised pattern recognition; computerised picture processing; integrated circuit manufacture; manufacturing computer control; scanning electron microscopy; semiconductor technology; surface topography measurement; 3D measuring system; 5 s; height profile measurement; nondestructive measurement; pattern height measurement; process line control; scanning electron microscope images; semiconductor patterned wafers; smoothly curved surfaces; trapezoidal patterns; Character recognition; Image edge detection; Image recognition; Laboratories; Manufacturing automation; Object detection; Pattern recognition; Scanning electron microscopy; Semiconductor device measurement; Shape measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 1990. IECON '90., 16th Annual Conference of IEEE

Conference_Location

Pacific Grove, CA

Print_ISBN

0-87942-600-4

Type

conf

DOI

10.1109/IECON.1990.149190

Filename

149190