Quantitative solder inspection with computed tomography

Author

Huang, R. ; Sorini, Adam ; McNulty, John

Author_Institution

Exponent, Inc., Menlo Park, CA, USA

fYear

2014

fDate

5-7 May 2014

Firstpage

82

Lastpage

85

Abstract

In this paper we present a quantitative, three-dimensional method to analyze solder characteristics and defect voids using X-ray Computed Tomography (CT). We also present a range of case studies where this methodology has enabled a more precise and time-efficient quality assurance process for printed circuit board suppliers, manufacturers and designers. This methodology also allows a comprehensive, non-destructive inspection and reconstruction of field return or failed samples involving printed circuit boards, hand-soldered assemblies or components, home appliances, and electrical systems.

Keywords

computerised tomography; inspection; nondestructive testing; printed circuits; quality assurance; solders; voids (solid); 3D method; CT; X-ray computed tomography; defect voids; electrical systems; failed samples; field return; hand-soldered assemblies; home appliances; nondestructive inspection; printed circuit board suppliers; quantitative solder inspection; solder characteristics; time-efficient quality assurance process; Capacitors; Computed tomography; Inspection; Printed circuits; Soldering; X-ray imaging; CT; Solder; Tomography; Voids; X-ray; cross section; quality;

fLanguage

English

Publisher

ieee

Conference_Titel

Product Compliance Engineering (ISPCE), 2014 IEEE Symposium on

Conference_Location

San Jose, CA

Print_ISBN

978-1-4799-5682-1

Type

conf

DOI

10.1109/ISPCE.2014.6842006

Filename

6842006