• DocumentCode
    1635411
  • Title

    New functional devices fabricated by bio nano process

  • Author

    Uraoka, Yukiharu ; Yamashita, Ichiro

  • Author_Institution
    Nara Inst. of Sci. & Technol., Ikoma, Japan
  • fYear
    2010
  • Firstpage
    1172
  • Lastpage
    1175
  • Abstract
    The memory effect in floating nanodot gate field effect transistor (FET) was investigated by fabricating biomineralized inorganic nanodot embedded metal-oxide-semiconductor (MOS) devices. Artificially biomineralized Co oxide cores accommodated in ferritins were utilized as a charge storage node of floating gate memory. Two dimensional array of Co oxide core accommodated ferritin were, after selective protein elimination, buried into the stacked dielectric layers of MOS capacitors and MOSFETs. Fabricated MOS capacitors and MOSFETs presented a clear hysteresis in capacitance-voltage (C-V) characteristics and drain current-gate voltage (ID-VG) characteristics, respectively. The observed hysteresis in C-V and ID-VG are attributed to the electron and hole confinement within the embedded ferritin cores. These results clearly support the biologically synthesized cores work as charge storage nodes. This work proved the feasibility of the biological path for fabrication of electronic device components.
  • Keywords
    MOS capacitors; MOSFET; field effect transistors; nanoelectronics; semiconductor storage; MOS capacitors; MOSFET; bio nano process; biomineralized Co oxide cores; biomineralized inorganic nanodot embedded metal-oxide-semiconductor; capacitance-voltage characteristics; drain current-gate voltage characteristics; floating gate memory; floating nanodot gate field effect transistor; functional devices; memory effect; selective protein elimination; stacked dielectric layers; Capacitance-voltage characteristics; Logic gates; MOS capacitors; MOSFETs; Nanobioscience; Nanoscale devices; Proteins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667593
  • Filename
    5667593