DocumentCode
163638
Title
A new method to prevent aluminum pad corrosion
Author
Guangcai Fu ; Liang Ni ; Xianming Zhang
Author_Institution
Technol. R&D center, Semicond. Manuf. Int. Corp., Shanghai, China
fYear
2014
fDate
18-20 May 2014
Firstpage
1
Lastpage
4
Abstract
The pad surface fluorine adsorption and the static charge will significantly cause the pad corrosion during the die saw process. In this paper, we will present a new method to prevent the pad corrosion during the die saw process by optimizing the pad fabrication process. During the PAD fabrication process, an extra gas treatment using N2/H2 base gas was added after PRS (Photo Resistor strip) process, which can reduce the static charge accumulation on the metal pad. Then, a new potential chemical, ST-44 (2-(2-Aminoethoxy) Ethanol, Butyrolactone and surfactant) was used to replace the conventional EKC chemical to clean fluorine on the pad surface. The previously mentioned N2/H2 treatment was repeated again after the wet cleaning by ST-44. The experiment results show that the pad corrosions can be solved during the die saw process. And the possible root causes and solutions have been discussed and illustrated.
Keywords
corrosion protection; hydrogen; microsensors; nitrogen; pressure sensors; surface cleaning; wafer level packaging; 2-2-Aminoethoxy Ethanol Butyrolactone and surfactant; N2-H2; PRS process; ST-44; aluminum pad corrosion; die saw process; extra gas treatment; pad fabrication process; pad surface fluorine adsorption; photo resistor strip process; static charge accumulation; wet cleaning; Chemicals; Corrosion; Fabrication; Micromechanical devices; Polymers; Sawing; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology (IWJT), 2014 International Workshop on
Conference_Location
Shanghai
Type
conf
DOI
10.1109/IWJT.2014.6842064
Filename
6842064
Link To Document